Besi, a Dutch semiconductor equipment manufacturer, holds a critical position in advanced packaging hybrid bonding technology—core enablers for AI and high-performance computing chips. The company is currently drawing intense global market attention.

On March 13, Besi declined to comment on merger rumors, stating it remains focused on executing its strategic plan and enhancing shareholder value as an independent company.

Reuters earlier reported that Besi is working with Morgan Stanley to evaluate strategic options, with Lam Research and Applied Materials identified as potential suitors.

Notably, Applied Materials is not only Besi's deep partner in hybrid bonding commercialization but also its largest shareholder, holding a 9% stake. This connection intensifies industry speculation about a potential acquisition.

As a leading European supplier of advanced placement and bonding equipment, Besi's technological strength is driving the acquisition interest from industry giants.

ICgoodFind: Besi's core hybrid bonding tech has sparked a tug-of-war between giants, with the outcome set to reshape the global advanced packaging equipment landscape.